Position Description (关键职责)

• Be responsible for the failure analysis of Power Integrated Module, guide the direction of analysis, find out the root cause and promote improvement.

  
  

• Be the FA lab technical leader to develop new FA technology and enhance FA lab capability.

  
  

• Guide FA team perform physical/electrical failure analysis on assembly level and die level using FA solutions, include microscope inspection (OM, SEM, PEM/OBIRCH), non-destructive methodology (curve tracer, x-ray, SAT, EDX) and destructive methodology (Chemical Decap, cross section, FIB).

  
  

• Submit the high quality Product Analysis Reports to the internal engineering and manufacturing staff as well as customers.

  
  

• Will drive quality improvement and provide corrective action recommendations as well as conduct hands-on failure analysis activities

  
  

Position Requirement (任职资格)

• Bachelor Degree or above, Good knowledge of the fundamentals of electronic circuitry (experience with ‘reading’ and analyzing electronic circuitry).

  
  

• Experience with module related failure analysis is a plus.

  
  

• Able to resolve complex failure issues and lead cross-functional teams.

  
  

• Fine communication ability with other departments and customers, strong team spirit.

  
  

• Good written and spoken English.